| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for measuring a film thickness distribution, which can more precisely measure a distribution of particles sputtered from a target, and can provide a distribution function for sputter simulation by processing the measured data into an appropriate expression as the simulation function of the measured values, and to provide a method for processing the measured data by the measuring device. SOLUTION: The measuring device for measuring the distribution of a sputter deposition rate comprises: a sputter target 3 on a target unit 2 placed in a film-forming chamber; a means 5 for measuring the distribution of a sputter deposition rate installed so as to rotate around the sputter target at a fixed radius in a plane perpendicular to the target face of the sputter target; and rotation-controlling means 4, 9, 10 and 11 for controlling the rotation of the means 5 for measuring the distribution of the sputter deposition rate, from the outside of the film-forming chamber. The processing method includes converting the measured data into Fourier series to obtain the distribution function. COPYRIGHT: (C)2007,JPO&INPIT
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