<p>A semiconductor wafer measuring device including a wafer mover adapted to move a semiconductor wafer; a measurement head adapted to scan a surface of the semiconductor wafer as the semiconductor wafer is moved by the wafer mover; and a controller. The controller is adapted to control movement of the wafer mover to provide a first scanning segment of a first portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the first scanning segment, a second scanning segment of a second different portion of the surface of the semiconductor wafer without rotating the semiconductor wafer during the second scanning segment; and rotating the semiconductor wafer between the first and second scanning segments.</p>
申请公布号
WO2006132998(A2)
申请公布日期
2006.12.14
申请号
WO2006US21531
申请日期
2006.06.02
申请人
RUDOLPH TECHNOLOGIES, INC.;LAZAROV, GUENADIY;ZHENG, LAURA;PINSKIY, ALEKSANDR