| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which whether a design layout pattern is good or not can be discriminated and a clear guideline for correction is presented. <P>SOLUTION: A tendency of inducing wiring failures in a design layout pattern of a semiconductor device by lithography and processing is quantified as a score; whether the design layout pattern is good or not is discriminated by the score; and if the pattern is discriminated as good, a transfer layout pattern transferred from the design layout pattern is formed on a semiconductor substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
