| 摘要 |
PROBLEM TO BE SOLVED: To provide a new method for manufacturing a sensor having ligand specifically bonded to a target specimen, and to provide a method and a device that uses the sensor. SOLUTION: The evanescent wave sensor is provided, which has ligand bonded to a sensor base via an NCYX linker component. The method for manufacturing the evanescent wave sensor is also provided and includes a step for bringing a first reactive component, having an isocyanate (or isothiocyanate) component into contact with a second reactive component, having hydroxy, thiol, or an amino component. A method is also provided to evaluate the bonding of specimens in a sample to the sensor through detecting of the evanescent waves by bringing the evanescent wave sensor into contact with the sample. A kit and a system for executing the method are also provided. COPYRIGHT: (C)2007,JPO&INPIT
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