| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having superior heat dissipation and thermal resistance, a method for easily manufacturing the semiconductor device and a low-cost and high-performance electronic device using the semiconductor device. <P>SOLUTION: In the semiconductor device 1, a chamfering 2c having a smooth curved shape is provided at a corner part between a chip-mounting surface 2a and an outer peripheral end surface 2b of a silicon sub-mount element 2 on which chip LEDs 3-6 are mounted, and further an insulating oxide layer 2d is continuously formed from the chip-mounting surface 2a to the outer peripheral end surface 2b along the chamfering 2c. In the electronic device, a metal core substrate is bonded to the rear surface of the semiconductor device 1, and a terminal part of the semiconductor device 1 and a terminal part of the metal core substrate are soldered together. <P>COPYRIGHT: (C)2007,JPO&INPIT |
