| 摘要 |
A method for manufacturing a semiconductor integrated circuit device is provided to improve a yield of a probe test by using a membrane probe. A semiconductor wafer divided into a plurality of chip regions is prepared. A semiconductor integrated circuit is formed in each of the chip regions. A plurality of first electrodes are formed on a main face on the semiconductor wafer to be electrically connected to the semiconductor integrated circuit. A first card is prepared. The first card includes a wiring substrate, a plurality of first sheets, a plurality of sheet holding units, a plurality of third wirings, and a plurality of pressing units. The semiconductor integrated circuits are electrically tested by contacting tips of contact terminals with the first electrodes.
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