| 摘要 |
A position correcting method for flux process and ball attach process of a semiconductor device is provided to reduce remarkably the generation of product failure by correcting errors many times. Whether a material arrives at a flux process position or not is determined(S11). When the material arrives at the flux process position, a fluxing apparatus and the material are photographed by using a camera(S12). First position values of the photographed material and fluxing apparatus are calculated and whether a first predetermined error is generated or not is checked(S13,S14). When the first predetermined error exists, the position of the fluxing apparatus is corrected(S15). A fluxing process is performed on the material(S16). A plug dotted on the material is photographed(S17). A second position value of the plug is calculated and whether a second predetermined error exists or not is checked(S18,S19). When the second predetermined error exists, the position of the fluxing apparatus is corrected again(S20).
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