发明名称 SUBSTRATE HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating apparatus which can peel off a resist on the back side of a treated substrate without lengthening a treating time, and can prevent substrate carriage errors due to steam generated from the back face of the treated substrate. SOLUTION: The substrate heating apparatus includes a substrate placing table 1 having a placing face 2 for placing a circular treated substrate W whose diameter is smaller than that of the treated substrate W, and heating means 3 for heating the treated substrate W on the placing face 2 by heating the substrate placing plate 1. A plurality of substrate holding members 4 engaged with a side edge Wa of the treated substrate W placed on the placing face 2, for controlling horizontal movement of the treated substrate W is arranged at intervals in the peripheral direction in the side peripheral position of the substrate placing table 1. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006339679(A) 申请公布日期 2006.12.14
申请号 JP20060255028 申请日期 2006.08.22
申请人 SHIBAURA MECHATRONICS CORP 发明人 MAEKAWA NAGAYOSHI
分类号 H01L21/3065 主分类号 H01L21/3065
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