| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for reflow soldering of the same for improving fatigue resistance of the soldering part of the semiconductor device by making the soldering angle of a solder bump an obtuse angle to form the solder bump to be almost in a shape of a drum by a simple method. SOLUTION: Between the semiconductor package and a circuit board, a spacer member is arranged. Thus, in the case of the reflow soldering, a gap between the semiconductor package and the circuit board is expanded longer than that before the reflow soldering by thermal expansion of the spacer member and thereafter, the solder is solidified with the gap kept therein, so that the soldering angle of the solder bump is made to be the obtuse angle to form the solder bump almost in the shape of the drum. The semiconductor device has a structure where stress and strain at the solder bump is dispersed during operation, so that the fatigue resistance strength at the soldering is improved in the fatigue life and reliability of the semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT |
