| 摘要 |
PROBLEM TO BE SOLVED: To improve a manufacturing property in assembling a semiconductor device using a metallic mold cleaning sheet. SOLUTION: In the cleaning sheet 29, through holes 29a are formed at a location corresponding to a cavity. In addition, slits 29b and cut portions 29c for a flow cavity are formed at the corner of the periphery of the through hole 29a. The slits, the cut portions and the through holes are formed between first and second molds of the metallic mold and used when cleaning the inside of the metallic mold to enhance a cleaning effect of the metallic mold. COPYRIGHT: (C)2007,JPO&INPIT
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