| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board where a resistive element of a desired resistant value is obtained even when a resistive layer is formed by printing a resistor paste by screen printing. SOLUTION: On the board 10, wiring patterns 12 provided with connections C are formed. Between the respective connections C of the wiring patterns 12, the resistive layer 18 consisting of a resistor paste is formed. The respective connections C of the wiring patterns 12 are thinner in film thickness than the other parts of the wiring patterns 12. COPYRIGHT: (C)2007,JPO&INPIT
|
