| 摘要 |
A module for a surface acoustic wave oscillator includes a substrate having a top surface, a bottom surface and peripheral side faces. Several castellations are located about the outer peripheral side faces thereof. The castellations form an electrical connection between the top and bottom surfaces of the substrate. Connection pads are mounted on the top surface and are adapted for connection to the castellations. An oscillator circuit and a surface acoustic wave device are mounted on the top surface and connected to the connection pads. A cover is mounted over the substrate and has at least one tab adapted to be fitted within a respective one of the castellations. The overall module with the cover has a dimension of approximately 5 mm in width, 7 mm in length, and 2.7 mm in height.
|
