发明名称 Detecting and improving bond pad connectivity with pad check
摘要 A method for analyzing an integrated circuit (or constituent parts thereof), a computer program implementing the method, and a computer configured to execute the program is disclosed. Analyzing the integrated circuit may include retrieving a design for the integrated circuit from a layout database, identifying the bond pads and gates included in the design of the integrated circuit, determining the connections between the bond pads and the gates, and determining whether a connection between a particular gate and a particular bond pad lacks a connection segment routed over a required layer.
申请公布号 US2006278871(A1) 申请公布日期 2006.12.14
申请号 US20050147541 申请日期 2005.06.08
申请人 HEGDE SHAILESH;BAADER PETER;NEUNHOEFFER TILMAN;ARMBRUSTER HANS-ULRICH 发明人 HEGDE SHAILESH;BAADER PETER;NEUNHOEFFER TILMAN;ARMBRUSTER HANS-ULRICH
分类号 H01L23/58 主分类号 H01L23/58
代理机构 代理人
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