发明名称 |
METHOD FOR FORMING METAL FILM AND METAL WIRING PATTERN, FOUNDATION COMPOSITION FOR FORMATION OF METAL FILM AND METAL WIRING PATTERN, AND METAL FILM |
摘要 |
<p>Disclosed is a method for forming a metal film comprising a step wherein an organic film is formed by applying a foundation composition for metal film formation containing an addition polymerizable monomer having an acidic group or an ester group thereof and a polymerization initiator onto a substrate or a film and polymerizing the applied composition; a step wherein the acidic group or its ester group in the organic film is formed into a metal (M1) salt of the acidic group; a step wherein the metal (M1) salt of the acidic group is formed into a metal (M2) salt by processing the organic film with an aqueous solution containing metal (M2) ions having a lower ionization tendency than the metal (M1) ions, and a step wherein a metal film is formed on the surface of the organic film by reducing the metal (M2) ions. Also disclosed are a foundation composition for metal film formation used in such a method, and a metal film formed by such a method.</p> |
申请公布号 |
WO2006132241(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
WO2006JP311322 |
申请日期 |
2006.06.06 |
申请人 |
OMRON CORPORATION;NAWAFUNE, HIDEMI;NAKAJIMA, SEIJI;MORI, TETSUYA |
发明人 |
NAWAFUNE, HIDEMI;NAKAJIMA, SEIJI;MORI, TETSUYA |
分类号 |
C23C18/30;C08J7/06 |
主分类号 |
C23C18/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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