发明名称 METHOD FOR FORMING METAL FILM AND METAL WIRING PATTERN, FOUNDATION COMPOSITION FOR FORMATION OF METAL FILM AND METAL WIRING PATTERN, AND METAL FILM
摘要 <p>Disclosed is a method for forming a metal film comprising a step wherein an organic film is formed by applying a foundation composition for metal film formation containing an addition polymerizable monomer having an acidic group or an ester group thereof and a polymerization initiator onto a substrate or a film and polymerizing the applied composition; a step wherein the acidic group or its ester group in the organic film is formed into a metal (M1) salt of the acidic group; a step wherein the metal (M1) salt of the acidic group is formed into a metal (M2) salt by processing the organic film with an aqueous solution containing metal (M2) ions having a lower ionization tendency than the metal (M1) ions, and a step wherein a metal film is formed on the surface of the organic film by reducing the metal (M2) ions. Also disclosed are a foundation composition for metal film formation used in such a method, and a metal film formed by such a method.</p>
申请公布号 WO2006132241(A1) 申请公布日期 2006.12.14
申请号 WO2006JP311322 申请日期 2006.06.06
申请人 OMRON CORPORATION;NAWAFUNE, HIDEMI;NAKAJIMA, SEIJI;MORI, TETSUYA 发明人 NAWAFUNE, HIDEMI;NAKAJIMA, SEIJI;MORI, TETSUYA
分类号 C23C18/30;C08J7/06 主分类号 C23C18/30
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