| 摘要 |
A method for forming a bump is provided to simplify a process by using a film for the bump. After a flexible film(11) for a bump is extended in both directions, a plurality of holes(13) are formed at a formation position of the bump. A solder(14) is positioned at the plurality of holes, which are formed on the film for the bump. A force applied to the film is removed to remove an empty space on the solder and the film for the bump. The film for the bump in which the solder is positioned is attached to the wafer on which the bump pattern is formed. Heat is applied to the wafer to absorb the film for the bump and the solder is attached on the bump pattern. The film for the bump is removed.
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