| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating treatment method where plating can be uniformly applied, and a film having low surface resistance can be obtained. SOLUTION: In the plating treatment method including a process where a film surface having the surface resistance of 1 to 1,000Ω/SQUARE is continuously subjected to electroplating for a plurality of times, the average plating treatment time in the first half part is made shorter than the average plating treatment time in the second half part. Alternatively, the average plating voltage in the second half part is controlled to≤60% of the average plating voltage in the first half part. COPYRIGHT: (C)2007,JPO&INPIT
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