| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser apparatus capable of flexibly coping with an amount of production of an excessive solder. SOLUTION: A solder clearance groove 12 having a width expansion 12A is provided in an element disposition region 11 of a heat sink 10. The cross section of the solder clearance groove 12 is made a trapezoidal shape that takes the inlet 12B of the surface of the heat sink 10 as an upper bottom, and the whole of the groove is taken as the width expansion 12A. The excessive solder is accommodated in the width expansion 12A without overflowing in the vicinity of the inlet 12B to flexibly cope with the amount of production of the excessive solder. It is preferable that the maximum width WA of the width expansion 12A is more than 100μm and less than 2 mm, and the width WB of the inlet 12B is more than 10μm or more and less than 300μm. The width expansion 12A may be a teardrop type, a branched shape or the like other than the trapezoidal shape. Alternatively, it may be a neck with substantially constant width up to the middle in a depthwise direction. The solder clearance groove 12 may be a form where its cross sectional area changes along an upper surface of the heat sink 10. COPYRIGHT: (C)2007,JPO&INPIT |
