| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of heat damage in an electronic component to be packaged even if using unleaded solder having a high melt point for a soldering method suitable for soldering by the unleaded solder, the electronic component, and a method of replacing a component. SOLUTION: The soldering method for performing the reflow soldering of a semiconductor device 12A onto a substrate 10 comprises a paste process for arranging solder paste 11 on the substrate 10; a component mounting process for mounting a semiconductor device 12A on the substrate 10 by using the solder paste 11; an arrangement process for arranging liquid-like silicone gel 18A for increasing thermal capacity in the semiconductor device 12A; and a soldering process for performing the reflow soldering of the semiconductor device 12A, where the liquid-like silicone gel 18A is arranged, on the substrate 10. COPYRIGHT: (C)2007,JPO&INPIT |
