| 摘要 |
PROBLEM TO BE SOLVED: To enable maintain soaking property of a substrate by maintaining soaking property of a guard ring. SOLUTION: A heat treatment apparatus is provided with a heating container 10 for housing a wafer W; a lamp unit 30 provided outside the heating container 10 and heating the wafer W to be housed in the heating container 10; and a susceptor 22 provided in the heating container 10 and holding the wafer W to be housed in the heating container 10. The heat treatment apparatus is further provided with a ring-like guard ring 25 held in the susceptor 22 and supporting the peripheral edge of the wafer W; and a guard ring 26 held in the susceptor 22, configured of the same material as that of the guard ring 25 on the external periphery of the guard ring 25, and arranged like a ring closely to the guard ring 25. COPYRIGHT: (C)2007,JPO&INPIT |
