| 摘要 |
PROBLEM TO BE SOLVED: To realize low cost by suppressing the number of LSI chips to be taken on a wafer by an electrode terminal of a scribing TEG (test element group). SOLUTION: A semiconductor device includes LSI chips 1 each formed by integrating an internal circuit consisting of semiconductor elements; and a scribing TEG formed on the scribing region 4 around the LSI chips and having evaluating elements 5 and the electrode terminals 6, wherein at least one of the evaluating terminals 5 of the scribing TEG and the electrode terminal 6 of the scribing TEG are separately formed in different regions in the scribing region 4 and electrically connected with each other. With this configuration, restriction in connection between the electrode terminals of the scribing TEG and the evaluating elements can be relieved, and as a result, the area of a scribing region can be reduced, and cost reduction of an LSI chip can be realized. COPYRIGHT: (C)2007,JPO&INPIT
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