| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method of electronic components such as semiconductor elements capable of sealing a package of a specified form by a simple operation at a low cost. SOLUTION: The sealing method of electronic components includes a process to arrange and fix a sealing laminate, so that an electronic component housing part houses electronic components mounted on a circuit board, which comprises the electronic component housing for housing and sealing electronic components, formed by laminating a plurality of pre-pregs. It also includes a process for sealing the electronic components housed in the electronic component housing of the sealing laminate. COPYRIGHT: (C)2007,JPO&INPIT
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