| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin soluble in an organic solvent and method for producing the same and to provide a polyimide resin with high stability in size and to provide a method for producing the same. SOLUTION: The polyimide resin is obtained by forming a polyamide resin by carrying out a polycondensation reaction of an acid dianhydride monomer containing an acid dianhydride represented by formula (I) with a specific diamine monomer (II) containing an aromatic group, and then imidizing the polyamide resin. The invention provides the polyimide resin with low water absorption, small coefficient of linear expansion, high in size stability, and excellent in thermal resistance, and provides a method for producing the same. The polyimide resin is preferably applied to adhesive use, the adhesive is preferably used for production of soft circuit boards, or the like. COPYRIGHT: (C)2007,JPO&INPIT
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