摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductor, which has excellent mold release characteristics in molding, continuous moldability, adhesivity to a lead frame, especially to a plated copper lead frame and properties of excellent solder reflow resistance. SOLUTION: The epoxy resin composition for sealing semiconductors is an epoxy resin composition which comprises (A) an epoxy resin, (B) a phenol-based resin, (C) a curing promoter and (D) an inorganic filler as main components and in which at least one of (A) the epoxy resin and (B) the phenol-based resin contains a resin of novolak structure having a biphenylene skeleton in a main chain. The epoxy resin composition comprises further (E)≥0.01 wt.% and≤1 wt.% of oxidized paraffin wax in the whole epoxy resin composition and (F)≥0.01 wt.% and≤2 wt.% of a triazole-based compound in the whole epoxy resin composition. . COPYRIGHT: (C)2007,JPO&INPIT
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