| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal joining method which can easily join metals under low-temperature and low-pressure conditions, without using lead-containing solder. SOLUTION: In joining two metals of which at least one is copper, the joining surface of the copper metal is exposed to an oxide film remover to remone an oxide film from the surface. The two metals are joined by touching the joining surfaces of the metals to be joined each other while remaining the oxide film remover on the surface of the copper metal and then heating and pressurizing them. The oxide film remover is, for example, an aqueous solution containing one or more of formic acid, formaldehyde, acetic acid, propionic acid, glyoxylic acid, oxalic acid, citric acid, succinic acid, tartaric acid, fumaric acid, maleic acid, malonic acid and salicylic acid. COPYRIGHT: (C)2007,JPO&INPIT |
