发明名称 SYSTEM COPING WITH FAILURE OF SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To continue a substrate treatment even if a failure is produced in one of processing systems by using the remaining normal processing systems and improve the production efficiency as a whole. SOLUTION: In a semiconductor manufacturing apparatus, substrates are separately treated by a plurality of process systems (PM1/PM2 and PM4/PM3). If a failure is produced in one (PM1/PM2) of the process systems, an integrated controller detects the failure and substrates which are to be treated by the process system in which the failure is produced are transferred to the other normal process system (PM4/PM3) and the treatment of substrates is continued. By continuing the substrate treatment as above described, the production efficiency as a whole can be improved in comparison with the conventional constitution wherein the treatment is interrupted. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006339662(A) 申请公布日期 2006.12.14
申请号 JP20060164588 申请日期 2006.06.14
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OKUNO MASANORI;MARUYAMA AKIRA;AKITA YUKIO;KIYOKU MASATOSHI
分类号 H01L21/02;H01L21/3065;H01L21/677 主分类号 H01L21/02
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