发明名称 Negative photoresist composition
摘要 There is provided a negative photoresist composition, which is used in a method of forming a pattern in which an underlayer film is provided on a substrate, a photoresist film formed from the negative photoresist composition is provided on top of the underlayer film, the photoresist film is selectively exposed, and the underlayer film and the photoresist film are then simultaneously subjected to a developing treatment, and which enables favorable resolution to be achieved. This composition includes (A) an alkali-soluble resin, (B) an acid generator that generates acid on irradiation, and (C) a cross-linking agent, and the acid generator (B) includes an onium salt containing a cation with no hydrophilic groups.
申请公布号 US2006281023(A1) 申请公布日期 2006.12.14
申请号 US20050556297 申请日期 2005.11.10
申请人 HIROSAKI TAKAKO;SHIMBORI HIROSHI 发明人 HIROSAKI TAKAKO;SHIMBORI HIROSHI
分类号 G03C1/00;G03F7/004;G03F7/038;G03F7/11;G11B5/31;G11B5/39 主分类号 G03C1/00
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