发明名称 |
Stack circuit member and method |
摘要 |
A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.
|
申请公布号 |
US2006278991(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
US20050311349 |
申请日期 |
2005.12.20 |
申请人 |
KWON YONG-CHAI;LEE KANG-WOOK;MA KEUM-HEE;HAN SEONG-II |
发明人 |
KWON YONG-CHAI;LEE KANG-WOOK;MA KEUM-HEE;HAN SEONG-II |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|