ADHESIVE COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE MAKING USE OF THE SAME AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

[PROBLEMS] To provided an adhesive composition for semiconductor that that permits handling without the occurrence of cracking or peeling even after flexing and at the time of laminating, permits laminating on the electrode side of a semiconductor wafer with bump electrode of bump electrode narrow pitch and high pin proportion, and that at the time of dicing, permits high-speed cutting without any cut powder contamination or defect, facilitating recognition of alignment marks at the time of dicing and flip chip mounting. [MEANS FOR SOLVING PROBLEMS] There is provided an adhesive composition for semiconductor comprising organic-solvent-soluble polyimide (a), epoxy compound (b) and curing accelerator (c), wherein per 100 pts.wt. of epoxy compound (b), there are contained 15 to 90 pts.wt. of organic-solvent-soluble polyimide (a) and 0.1 to 10 pts.wt. of curing accelerator (c), and wherein the epoxy compound (b) contains a compound being liquid at 25°C under 1.013×10⁵ N/m² and a compound being solid at 25°C under 1.013×10⁵ N/m², and wherein the ratio of compound being liquid based on all the epoxy compounds is in the range of 20 to 60 wt.%.