Integrated circuit (IC) packaging technique involves using environmental benign thermal plastic material which is injected into packaging mold cavity for packaging and molding IC chip on chip mount using heat and pressure

摘要

The method begins by die bonding an IC chip on a chip mount. The IC chip is then wire-bonded to the chip mount. Solidifying a connection wire follows the wire bonding process. A packaging material is then injected into a mold cavity for packaging and molding the IC chip and chip mount using heat and pressure. Final testing and packaging are then performed afterwards. A recyclable and environmental benign thermal plastic material is used to package the IC chip with a conventional plastic injection machine. The thermal plastic material is decomposable and recyclable.