SPUTTERING APPARATUS

摘要

A sputtering apparatus capable of preventing leakage of plasma while proceeding sputtering is provided. A sputtering apparatus comprises: a substrate(38) on which a deposition film is formed; a floating mask(34) formed on an upper portion of the substrate to mask a non-deposition part of the substrate; a mask(32) formed in such a manner that the mask is superposed on both sides of the substrate and insulated with the floating mask; a target(42) on which a deposition material is formed; and a ground shield(46) that is protruded from the edge of the substrate and has an extension part for enlarging the area facing the mask and reducing a gap with the mask. The ground shield is formed in a "[" character shape. The extension part of the ground shield facing the mask comprises at least one serrated cross-sectional shape.