发明名称 Wiring-connecting material and wiring-connected board production process using the same
摘要 The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
申请公布号 EP1732372(A1) 申请公布日期 2006.12.13
申请号 EP20060118942 申请日期 2000.08.25
申请人 HITACHI CHEMICAL CO., LTD. 发明人 FUJINAWA, TOHRU;YUSA, MASAMI;NOMURA, SATOYUKI;ONO, HIROSHI;WATANABE, ITSUO;ARIFUKU, MOTOHIRO;KANAZAWA, HOUKO
分类号 C08J5/00;H05K3/32;C08F283/00;C08F290/06;C08G18/48;C08G18/66;C08G18/81;C08J3/20;C08L51/08;C08L75/04;C09J4/06;C09J9/02;C09J175/04 主分类号 C08J5/00
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