发明名称 |
Silicone resin composition for die bonding |
摘要 |
A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23°C, (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region. |
申请公布号 |
EP1731570(A1) |
申请公布日期 |
2006.12.13 |
申请号 |
EP20060252869 |
申请日期 |
2006.06.02 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
MIYOSHI, KEI;GOTO, TOMOYUKI;YAMAKAWA, NAOKI |
分类号 |
C08L83/04;C08G77/12;G02B1/04;H01L33/48 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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