发明名称 COMPOUND SEMICONDUCTOR DEVICE, PRODUCTION MEHTOD OF COMPOUND SEMICONDUCTOR DEVICE AND DIODE
摘要 A compound semiconductor device includes hexagonal silicon carbide crystal substrate and a boron-phosphide-based semiconductor layer formed on the silicon carbide crystal substrate, wherein the silicon carbide crystal substrate has a surface assuming a (0001) crystal plane, and the boron-phosphide-based semiconductor layer is composed of a 11111 crystal stacked on and in parallel with the {0001} crystal plane of the silicon carbide crystal substrate, and when the number of the layers contained in one periodical unit of an atomic arrangement in the [0001] crystal orientation of the silicon carbide crystal substrate is n, an n-layer-stacked structure included in the { 111 } crystal plane forming the { 111 } crystal has a stacking height virtually equal to the c-axis lattice constant of the silicon carbide crystal substrate.
申请公布号 KR20060128035(A) 申请公布日期 2006.12.13
申请号 KR20067020015 申请日期 2006.09.27
申请人 SHOWA DENKO KABUSHIKI KAISHA 发明人 UDAGAWA TAKASHI
分类号 H01L21/20;H01L21/205;H01L21/338;H01L29/04;H01L29/20;H01L29/24;H01L29/26;H01L29/267;H01L29/778;H01L29/812;H01L29/861;H01L29/866;H01L29/93;H01L33/00;H01L33/16;H01L33/30 主分类号 H01L21/20
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