SOLDERING APPARATUS FOR SUBSTRATE, SOLDERING METHOD FOR SUBSTRATE AND SOLDER-CREAM PRINTER FOR SUBSTRATE

摘要

A soldering apparatus for a PCB, a soldering method thereof, and a solder cream printer for PCB soldering are provided to perform reliable and stable soldering, by soldering an electronic component on a PCB with a high density. In a soldering apparatus for a PCB for soldering the PCB and an electronic component(15) arranged on the PCB, a PCB inverter supports the PCB while rotating the PCB. A solder cream printer prints a solder cream(19a) on a plurality of lead holes(13) formed on the PCB as a bottom plane of the PCB is inverted toward the top by the PCB inverter. A hardener hardens the solder cream as the electronic component is inserted into the lead hole after the top plane of the PCB is recovered by the PCB inverter.