发明名称 EXHAUST SYSTEM FOR REFLOW SOLDERING APPARATUS
摘要 An exhaust system of a reflow soldering device is provided to extend the lifetime of the exhaust system by effectively ejecting high-temperature air through a jet nozzle where an ejection hose is coupled. An exhaust system for a reflow soldering device is a box-shaped housing(10), coolers(30), and a fan(40). Plural heaters are arranged in a transfer direction of a conveyor, on which a printed circuit board is mounted, inside the housing. The coolers are arranged to be parallel to the heaters. The fan is penetrated into an upper center of the housing and includes a box-shaped distributor, a jet nozzle, and a ventilating hole. At least one air inlet hole is formed at one or both sides of the box-shaped distributor. The jet nozzle is mounted on the distributor and includes a compressed air spraying hose, which is coupled with a hose connecting unit. The ventilating hole is vertically coupled with an upper end of the jet nozzle.
申请公布号 KR100659770(B1) 申请公布日期 2006.12.13
申请号 KR20050087345 申请日期 2005.09.20
申请人 TSM CO., LTD. 发明人 LEE, JONG HO
分类号 H05K3/34 主分类号 H05K3/34
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