发明名称 Method for fabricating nitride-based compound semiconductor element
摘要 A method for fabricating a nitride semiconductor element according to the present invention comprises the steps of: forming a nitride semiconductor layer 13 on a base substrate 11 ; forming, on part of the upper surface of the nitride semiconductor layer 13 , a conductive film 14 made of an electron emitting layer 14 b and a dry etching mask layer 14 a from bottom to top; performing dry etching on the nitride semiconductor layer 13 ; and performing wet etching on the nitride semiconductor layer 13 by emitting electrons from the nitride semiconductor layer 13 through the conductive film 14 to the outside.
申请公布号 US7148149(B2) 申请公布日期 2006.12.12
申请号 US20040017681 申请日期 2004.12.22
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OHNO HIROSHI;TAMURA SATOSHI;UEDA TETSUZO
分类号 H01L21/302;H01L21/306;H01L21/3063;H01L21/3065;H01L21/308;H01L33/00 主分类号 H01L21/302
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