| 摘要 |
A LED-based light emitting device having integrated rectifier circuit driven directly by an AC voltage and a related fabrication method is provided herein. The light emitting mainly contains a lower substrate and an upper substrate. The lower substrate has a built-in rectifier circuit and appropriate electrical contacts of the rectifier circuit are exposed on the top surface of the lower substrate. The upper substrate contains multiple LEDs arranged in an NxM array and the LEDs are all electrically insulated from each other. Metallic plating techniques are applied to establish electrical connection between these LEDs so that they jointly form a circuit matching the rectifier circuit on the lower substrate. The two substrates are faced towards each other and metallic bumps are applied to connect the LED circuit on the upper substrate to the rectifier circuit on the lower substrate, completing a fully function light emitting device.
|
