| 发明名称 |
CMP composition containing organic nitro compounds |
| 摘要 |
A composition and process for the precision polishing of substrates such as semi-conductor chips is disclosed. The composition and process make use of soluble or insoluble organic nitro compounds as oxidizers and/or abrasive particles. Nitrogen containing reduction products of the foregoing organic nitro compounds may also be included.
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| 申请公布号 |
US7148147(B2) |
申请公布日期 |
2006.12.12 |
| 申请号 |
US20050243563 |
申请日期 |
2005.10.05 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/302;C09G1/02;C09K13/00;C09K13/06;C23F3/00;H01L21/306;H01L21/321 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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