| 发明名称 |
Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor |
| 摘要 |
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
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| 申请公布号 |
US7147767(B2) |
申请公布日期 |
2006.12.12 |
| 申请号 |
US20020320263 |
申请日期 |
2002.12.16 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
BOYD STEVEN D.;KESARI SUSRUT;LAMANNA WILLIAM M.;PARENT MICHAEL J.;ZAZZERA LAWRENCE A.;ZHANG HAIYAN |
| 分类号 |
C25D3/38;C23C16/00;C23C18/00;C23C18/40 |
主分类号 |
C25D3/38 |
| 代理机构 |
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