发明名称 |
Aqueous based metal etchant |
摘要 |
The present invention provides an aluminum etchant solution for etching an aluminum surface in the presence of solder bumps. The etchant solution includes about 42% to about 80% phosphoric acid; about 0.1% to about 6% nitric acid; about 5% to about 40% acetic acid; about 0.005% to about 5% of an amine oxide surfactant; about 0.1% to about 8% of a Pb solubilizing additive; and about 5 to about 25% de-ionized water; wherein the solder bumps are substantially phosphate free after the etching. Also provided is a process for etching an exposed aluminum surface in a semiconductor structure in the presence of solder bumps including the steps of: contacting the exposed aluminum surface with the etchant solution; rinsing the semiconductor structure with de-ionized water; and drying the semiconductor structure to remove residual water; wherein the solder bumps are substantially phosphate free after the etching.
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申请公布号 |
US7147798(B2) |
申请公布日期 |
2006.12.12 |
申请号 |
US20040921785 |
申请日期 |
2004.08.19 |
申请人 |
ARCH SPECIALTY CHEMICALS, INC. |
发明人 |
GONZALEZ FRANK;KNEER EMIL;ELDERKIN MICHELLE;LEON VINCE |
分类号 |
C09K13/00;C23F1/20;C23F1/44;H01L21/302;H01L21/3213;H01L21/60 |
主分类号 |
C09K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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