发明名称 Memory circuitry and method of forming memory circuitry
摘要 A method of forming memory circuitry having a memory array having a plurality of memory capacitors and having peripheral memory circuitry operatively configured to write to and read from the memory array, includes forming a dielectric well forming layer over a semiconductor substrate. A portion of the well forming layer is removed effective to form at least one well within the well forming layer. An array of memory cell capacitors is formed within the well. The peripheral memory circuitry is formed laterally outward of the well forming layer memory array well. In one implementation, memory circuitry includes a semiconductor substrate. A plurality of word lines is received over the semiconductor substrate. An insulative layer is received over the word lines and the substrate. The insulative layer has at least one well formed therein. The well has a base received over the word lines. The well peripherally defines an outline of a memory array area. Area peripheral to the well includes memory peripheral circuitry area. A plurality of memory cell storage capacitors is received within the well over the word lines. Peripheral circuitry is received within the peripheral circuitry area and is operatively configured to write to and read from the memory array.
申请公布号 US7148536(B2) 申请公布日期 2006.12.12
申请号 US20030728977 申请日期 2003.12.08
申请人 MICRON TECHNOLOGY, INC. 发明人 COURSEY BELFORD T.
分类号 H01L29/76;H01L21/02;H01L21/8242;H01L31/113;H01L31/119 主分类号 H01L29/76
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