THICK-FILM DIELECTRIC AND CONDUCTIVE COMPOSITIONS

摘要

Provided are dielectric powder and a thick-film paste composition having a high dielectric constant, low loss tangent and desired electrical and physical properties, and useful for forming a fired-on-foil passive circuit element. The dielectric powder includes copper-based electrode powder comprising copper powder, cuprous oxide powder ad lead germanate glass powder. The electrode powder comprises 84-100 wt% of copper powder, less than 10 wt% of cuprous oxide powder and less than 5 wt% of lead germanate glass powder. The electrode powder optionally further comprises nickel powder in an amount of 1 wt% or less based on the weight of the copper powder.