| 摘要 |
<p>An array type semiconductor package is provided to obtain high luminance and radiate effectively heat by arraying a plurality of semiconductor chips on a substrate and attaching a metal plate under the substrate. A lower substrate(30) is formed with a conductive material. An upper substrate(40) is laminated on the lower substrate. A plurality of semiconductor chips for light source are arrayed on an upper surface of the upper substrate. A semiconductor device and a noise removal circuit are installed on the upper substrate to interrupt static electricity and a surge. The semiconductor chips for light source are attached to the upper substrate by using a molding method. The lower substrate is formed with a metal plate having a plurality of metal pins(32).</p> |
