| 摘要 |
<p>A photosensitive resin composition which cures with a radiation to give a film which is excellent in marring resistance and wearing resistance and has a low refractive index and which, when used as an antireflection film, has a low reflectance. The photosensitive resin composition is characterized by comprising (A) an epoxidized silicon compound obtained by condensing, in the presence of a basic catalyst, an epoxidized alkoxysilicon compound represented by the following general formula (1) ReSi(OR1)3 (1) (wherein Re represents a substituent having epoxy; and R1 represents C1- 4 alkyl) with itself or with a fluorinated alkoxysilicon compound represented by the following general formula (2) RfSi(OR 2)3 (2) (wherein Rf represents a substituent having 1 to 20 fluorine atoms; and R2 represents C1-4 alkyl) and (B) a cationic photopolymerization initiator and optionally containing (C) a fluorinated polymer, (D) colloidal silica having a primary-particle diameter of 1 to 200 nm, and (E) a polymer having a (poly)siloxane structure in a side chain.</p> |
