发明名称 THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET-FORM MOLDED FOAM, AND PROCESS FOR PRODUCING THE SAME
摘要 <p>A thermally conductive pressure- sensitive adhesive composition which comprises a metal hydroxide and a (meth)acrylic ester copolymer obtained by polymerizing a monomer mixture comprising a (meth)acrylic ester monomer forming a homopolymer having a glass transition temperature of -20°C or lower, a monomer having an organic acid group, and a monomer copolymerizable therewith, in the presence of a copolymer comprising units of a (meth)acrylic ester monomer forming a homopolymer having a glass transition temperature of -20°C or lower, units of a monomer having an organic acid group, units of a monomer having a functional group other than the organic acid group, and units of a monomer copolymerizable therewith, the (meth)acrylic ester copolymer having been foamed. The composition has an excellent balance between hardness and pressure-sensitive adhesive properties. It has performances including excellent shape conformability. It can be provided as a sheet which can be easily formed. The sheet obtained can be easily stripped from the adherend after use. Also provided is a thermally conductive sheet-form molded foam comprising the composition.</p>
申请公布号 KR20060127049(A) 申请公布日期 2006.12.11
申请号 KR20067014304 申请日期 2006.07.14
申请人 ZEON CORPORATION 发明人 MIKUNI TAKAMITU;IWABUCHI SATOSI;OGIWARA MANABU
分类号 C09J133/04;B32B5/18;B32B27/30;C08J9/06;C08K3/22;C08K3/36;C08L33/04;C09J5/08;C09J7/00;C09J7/02;C09J9/00;C09J9/02;C09J11/04;H01L23/373 主分类号 C09J133/04
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