| 发明名称 |
CMP POROUS PAD WITH COMPONENT-FILLED PORES |
| 摘要 |
The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing pad.
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| 申请公布号 |
KR20060127221(A) |
申请公布日期 |
2006.12.11 |
| 申请号 |
KR20067019556 |
申请日期 |
2005.03.14 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
PRASAD ABANESHWAR |
| 分类号 |
C09G1/02;B24B37/04;B24D3/32;H01L21/321 |
主分类号 |
C09G1/02 |
| 代理机构 |
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