POLISHING PAD COMPRISING HYDROPHOBIC REGION AND ENDPOINT DETECTION PORT

摘要

The invention provides a chemical-mechanical polishing pad comprising a polishing layer (10) comprising a hydrophobic region (30), a hydrophilic region (40), and an endpoint detection port (20). The hydrophobic region is substantially adjacent to the endpoint detection port (80). The hydrophobic region (30) comprises a polymeric material having a surface energy of 34 mN/rn or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.