TAPE PACKAGE OF HEAT SPREADING TYPE AND FLAT PANEL DISPLAY USING THE SAME

摘要

A tape package of heat spreading type and a flat panel display using the same are provided to radiate heat of a semiconductor chip by attaching a metal film on a tape wiring substrate except for a bonding part between the semiconductor chip and the tape wiring substrate. A semiconductor chip(110) includes an electrode bump which is formed around an activation side. The semiconductor chip is bonded through the electrode bump to an upper surface of a tape wiring substrate(120). A molding resin(130) is used for protecting a bonding part between the semiconductor chip and the tape wiring substrate. A first metal film(141) is attached on the upper surface of the tape wiring substrate except for the semiconductor chip. A second metal film(143) is attached on a lower surface of the tape wiring substrate under the semiconductor chip.