| 摘要 |
A production process tape for film-shaped wiring board that exhibits high heat resistance, mechanical properties, moldability and dimensional stability and that excels in productivity and workability, realizing low cost. There is provided a production process tape for film-shaped wiring board, which consists of a sheet comprising at least one thermoplastic resin, the thermoplastic resin selected from among a polysulfone resin, a thermoplastic polyimide resin and a polyether aromatic ketone resin, and a plate filler, which sheet exhibits an antiflexing strength (JIS P8155: tension 250 g, flexing rate 175 times/min, and flexing surface 0.38R) of 10 times or more and a linear expansion coefficient of 50 ppm/°C or below.
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