| 发明名称 |
Die attach adhesives for use in microelectronic devices |
| 摘要 |
<p>A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds and a curing initiator.</p> |
| 申请公布号 |
HK1041712(A1) |
申请公布日期 |
2006.12.08 |
| 申请号 |
HK20020103421 |
申请日期 |
2002.05.06 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
HERR, DONALD, E. |
| 分类号 |
C08F290/06;C08G;C08F22/40;C08F222/40;C08F283/04;C08F283/12;C08F290/04;C08F291/00;C08F299/00;C08G18/28;C08G18/75;C08G77/42;C08L;C09J;C09J4/00;C09J4/06;C09J135/00;C09J151/00;C09J151/08;C09J177/00;C09J179/08;C09J183/04;C09J183/10;H01L21/52;H01L21/60;H05K;H05K3/30 |
主分类号 |
C08F290/06 |
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